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Raytheon Missiles and Defense (RMD), a technology and innovation leader specializing in defense, security and civilian markets, is seeking an experienced Mechanical Engineer for the RF Department. This organization is responsible for designing state-of-the-art RF products including antennas, RF Circuit Card Assemblies (CCAs), radomes, and RF test equipment.
The candidate will be responsible for providing innovative design solutions for the packaging of antennas, RF Circuit Card Assemblies, radomes, and RF test equipment within the company. The selected candidate will also be expected to lead diverse teams, provide technical oversight, delegate tasks, and work with the Engineering organization to establish technology roadmaps, enable modernization, and contribute to general innovation. In addition, the candidate will work with government personnel and programs, and define and refine requirements to validate hardware compliance. The candidate will be responsible for providing guidance, coaching, mentoring, and training to other employees across the business within the candidate’s areas of expertise.
Required Experience and Skills:
Must be a U.S. citizen
A minimum of two (2) years of professional experience performing design and analysis for the packaging of RF products (e.g. Circuit Card Assemblies, antennas, radomes, RF test equipment, harnesses and interconnects) throughout the product life cycle to include three dimensional (3D) Computer Aided Design (CAD) software
Creation of Technical Data Packages (TDPs) using Geometric Dimensioning and Tolerancing (GD&T) for RF products
Experience creating and presenting professional level design documentation to company leadership and program customers
Must have, or be able to obtain, at a minimum, an active DoD Secret Clearance
Minimum of a Bachelor of Science (BS) in mechanical engineering
Desired Experience and Skills:
Master of Science (MS) in mechanical engineering or electrical engineering
Experience serving as a Responsible Engineering Authority (REA), Control Account Manager (CAM), and/or Integrated Product Team Lead (IPTL)
Supplier management for built to print or build to specification RF products
Creo Simulate or ANSYS Workbench for preliminary structural and thermal analysis of design concepts
Excellent written and verbal communication skills
Failure investigation, root cause identification, and corrective action implementation
Familiarity or direct experience with RF Printed Circuit Board (PCB) material stack ups and Circuit Card Assembly (CCA) layout
One dimensional tolerance analysis for complex mechanical assemblies
Development of technical proposals, engineering project estimates, and/or white papers
Requirements verification test planning and execution
Reliably meets program and functional commitments
Seeks to produce common work products and leverage lessons learned
Understands the relationship between technical concepts and requirements
Seeks opportunities to learn and fill any role necessary to help ensure organization success
Effectively manages time and prioritizes tasks while supporting multiple projects
Begins to identify and articulate risks associated with engineering decisions. Solicits guidance from team or leadership to assess impact and modify the solution
Drives solutions for solving complex problems while considering quality, cost, schedule and performance impact
This position requires the successful issuance, transfer or maintenance of any clearances and/or accesses necessary for the position. Non-US citizens may not be eligible to obtain a security clearance. The Defense Industrial Security Clearance Office (DISCO), an agency of the Department of Defense, handles and adjudicates the security clearance process. Security clearance factors include, but are not limited to, allegiance to the US, foreign influence, foreign preference, criminal conduct, security violations and drug involvement. Additional detail regarding security clearance factors can be obtained by accessing the DISCO website at: https://www.state.gov/security-clearances
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