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- Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, a related field, or equivalent practical experience.
- 1 year of experience in semiconductor wafer fabrication.
- Experience with root cause analysis, failure analysis, and data analysis techniques.
- Ability to work non-standard hours, such as a compressed schedule of four 10 hour shifts a week, including weekends.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
- 5 years of experience in semiconductor wafer fabrication, with expertise in multiple process areas.
- Experience with yield improvement, defectivity reduction, and cycle time reduction initiatives.
- Experience with equipment qualification and implementation.
- Communication and documentation skills.
Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.
The US base salary range for this full-time position is $102,000-$150,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
- Monitor, sustain, and support daily wafer fabrication processes encompassing areas of lithography, thin film, etch, clean, thermal, metrology/characterization and backside end of line processses.
- Ensure process reliability and consistency by providing technical support to operators, technicians, and other engineers.
- Review, propose, optimize, improve and implement various wafer fabrication processes for yield improvement, defectivity reduction, cycle time reduction, and general best practises of wafer handling.
- Enhance area process control plan and the process capability through implementation of best known manufacturing methods and statistical process control (SPC).
- Drive problem resolution process associated with the quality excursion in the fab area encompassing data analytics, methodical problem solving, failure analysis (FA), design of experiments (DOE), and mistake-proof.
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