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Google welcomes people with disabilities.
Minimum qualifications:- Bachelor's degree in Electrical, Mechanical, Chemical, or equivalent practical experience.
- 10 years of experience in manufacturing, or process development in semiconductor packaging and SMT.
- Experience in advanced IC packaging qualifications, metallurgy, thermal dynamics, and Design of Experiments.
- Experience in microstructure, material characterization, solder alloy, Indium, and Copper interconnect long-term reliability.
Preferred qualifications:
- Master's degree in Electrical, Mechanical, Chemical, or related disciplines.
- Understanding of industry trends, emerging technologies, and competitive dynamics within the field of solder alloys and STIMs.
- Demonstrated record of delivering robust innovative manufacturing solutions, leading failure analysis investigations and resolutions, and overseeing yield improvements for high complexity products.
- Expertise in designing and conducting experiments to evaluate material properties, performance, reliability, and compatibility with various packaging substrates and components.
- Excellent communication and investigative skills, able to collaborate with multi-geo teams on complex projects spanning multiple technologies.
Google's custom-designed machines make up one of the largest and most powerful computing infrastructures in the world. The Hardware Testing Engineering team ensures that this cutting-edge equipment is reliable. In the R&D lab, you design test equipment for prototypes of our machinery and develop the protocols used to scale these tests for the entire global team. Working closely with design engineers, you give input on designs to improve our hardware until you're sure it meets Google's standards of quality and reliability.
Google's global deployment of custom-designed machines has created one of the largest and most powerful computing infrastructures in existence, cutting-edge innovation on a huge scale.
In this role, you will design and build the software, hardware, computing platform, and networking technologies that power all of Google's services. You will join the team responsible for new and innovative manufacturing technology and processes enabling New Product Introduction (NPI). You will be a valued partner to the product development team, identify Design for Manufacturability (DFM) opportunities, and support delivery of the highest caliber products and fulfillment chains.
Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Google's product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
- Lead the research, development, and characterization of solder alloys to meet Surface Mount Technology (SMT) and thermal requirements. Innovative manufacturing processes solutions and capabilities including industry first process definition, startup and qualification.
- Design and execute experiments to evaluate material properties, performance, reliability, and compatibility with various substrates and apply metallurgical techniques and investigative tools (e.g., microscopy, spectroscopy, thermal analysis) to investigate material behavior and failure mechanisms.
- Collaborate with design engineering on NPI roadmaps, develop plans, and Design of Experiments to enable new products via manufacturing technology and process development.
- Coordinate with supply chain managers to identify and build up robust new manufacturing supply chains. Conduct process audits at potential suppliers and manufacturing partners where necessary.
- Lead to align manufacturing partners process capabilities with Google products roadmap. Contribute to the team's New Technology Introduction (NTI) strategy.
