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Posted 8 days ago
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Job Details

Meta is looking for an experienced Silicon Packaging design Engineer for its Ecosystem and Technical Operation team to support the development of custom Silicon for Infrastructure as well as to develop packaging solutions that are optimal for our ASIC roadmap. We are building a competency in Packaging technology to support the development of custom silicon and looking for expertise in hardware development and integration of machine learning clusters, both server and fabric with focus on the impact they can create as part of a world-class engineering team.

Silicon Packaging Design Engineer Responsibilities:
  • Perform package design for advanced custom silicon comprising single-chip/multi-chip and 3D or wafer packaging. This includes: design feasibility studies and analyses, package design/layouts based on silicon chip IO, electrical performance and system ID/form factor requirements
  • Participate in silicon architecture/package/PCB/system co-design work collaborating with downstream system design teams and upstream silicon designers to develop holistically optimal solutions
  • Co-work with internal silicon, architecture and system teams and externally engaged partners, ASIC design partners, foundry and OSAT and substrate vendors
  • Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/3D and heterogeneous integration to improve bandwidth, power efficiency and package form factor for next generation versions of current products
  • Lead package development to establish package manufacturability and reliability
  • Collaborate with multi-functional teams with in Meta and define package requirements


Minimum Qualifications:
  • Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience.
  • 10+ years of experience in advanced silicon packaging design
  • Experience in advanced package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
  • Basic understanding in one of the SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.
  • Hands of experience in interposer or fanout package design for both organic and inorganic interposer with or without bridges
  • Bachelor's degree in Electrical engineering, Materials Engineering, Computer Engineering, relevant technical field, or equivalent practical experience.
  • Proven fundamentals in the electrical/material/thermal or mechanical engineering field(s).
  • Effective communication skills and experience working effectively with cross-functional teams


Preferred Qualifications:
  • Master’s or PhD degree in Electrical/Materials engineering
  • Experience and prior experience of taking products from concept to prototyping and production
  • In-depth knowledge of flip chip, 2.5D and 3D and wafer packaging technologies package design
  • Familiarity with CAM350/Valor or Calibre and CAD along with experience in package design reviews.
  • Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
  • Solid understanding of Design Rules Check and Design for Manufacturing.


About Meta:
Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology. People who choose to build their careers by building with us at Meta help shape a future that will take us beyond what digital connection makes possible today—beyond the constraints of screens, the limits of distance, and even the rules of physics.

Meta is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender, gender identity, gender expression, transgender status, sexual stereotypes, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics. We also consider qualified applicants with criminal histories, consistent with applicable federal, state and local law. Meta participates in the E-Verify program in certain locations, as required by law. Please note that Meta may leverage artificial intelligence and machine learning technologies in connection with applications for employment.

Meta is committed to providing reasonable accommodations for candidates with disabilities in our recruiting process. If you need any assistance or accommodations due to a disability, please let us know at accommodations-ext@fb.com.

$173,000/year to $249,000/year + bonus + equity + benefits

Individual compensation is determined by skills, qualifications, experience, and location. Compensation details listed in this posting reflect the base hourly rate, monthly rate, or annual salary only, and do not include bonus, equity or sales incentives, if applicable. In addition to base compensation, Meta offers benefits. Learn more about benefits at Meta.
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Silicon Packaging Design Engineer
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